Multi-layer semiconductor package with vertical connectors and method of manufacture thereof

ABSTRACT

A semiconductor package comprises a base substrate with a semiconductor die mounted on a top side of the base substrate and an interposer substrate mounted on top of the die. The bottom side of the interposer substrate can be electrically coupled to the top side of the base substrate through vertical connectors. The top side of the interposer substrate is substantially exposed and comprises input/output (I/O) terminals for the mounting of additional electronic components. The base and interposer substrates can be configured with I/O terminals such that components mounted on the substrates can be electrically coupled through the vertical connectors. The base substrate also can be electrically coupled to an additional electronic component, such as a printed circuit board. Electrical connections can be “wrapped around” from the base substrate to the top of the interposer substrate. The vertical connectors can be positioned along multiple sides of the package.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This is a continuation of U.S. patent application Ser. No. 11/608,164,U.S. Pat. No. 7,608,921, filed Dec. 7, 2006.

FIELD

This disclosure relates to semiconductor packaging.

BACKGROUND

Electronic devices often employ multiple semiconductor components, e.g.,several microchips. Some devices can be implemented in “multi-chipmodules” that typically comprise a printed circuit board (PCB) substrateonto which a set of separate microchips is directly attached. Suchmulti-chip modules can increase circuit density and miniaturization, butthey also can be bulky.

One method for reducing the size of multi-chip modules and therebyincreasing their effective density is to stack the die or chipsvertically. Conventional examples of this approach are thepackage-on-package (PoP) and package-in-package (PiP) configurationswhich can save space, e.g., on a PCB. These packages can be, forexample, on the order of about 15 mm square, with a height of about 2mm.

Some package designs place an interposer above a die. For example, U.S.Pat. No. 6,861,288 to Shim et al. discloses: “A method for fabricating astacked semiconductor package includes providing a substrate andmounting a first semiconductor device on the substrate. An interposer issupported above the first semiconductor device opposite the substrate.The interposer is electrically connected to the substrate. A secondsemiconductor device is then mounted on the interposer.” See Abstract.However, this design can result in a package with an area much largerthan the area of the packaged die.

In view of the above, improved semiconductor packages and packagingmethods are needed.

SUMMARY

A semiconductor package can comprise a base substrate with asemiconductor die mounted on the top side of the base substrate, andwith an interposer substrate mounted on top of the die. The bottom sideof the interposer substrate can be electrically coupled to the top sideof the base substrate through vertical connectors. The top side of theinterposer substrate is substantially exposed for the mounting ofadditional electronic components. The base and interposer substrates canbe configured with input/output (I/O) terminals such that componentsmounted on the substrates can be electrically coupled with each otherthrough the vertical connectors. The base substrate also can beelectrically coupled to an additional electronic component, such as aPCB.

In one embodiment, a semiconductor package comprises a first substratehaving first and second major planar surfaces defined by a firstperimeter, a first semiconductor die electrically coupled to the secondmajor planar surface of the first substrate, a second substrate havingfirst and second major planar surfaces defined by a second perimeter, afirst plurality of vertical connectors configured to electrically couplethe first major planar surface of the second substrate to the secondmajor surface of the first substrate, and a first encapsulating resinsituated between the semiconductor die and the second surface of thefirst substrate, the encapsulating resin also encompassing at least aportion of at least some of the vertical connectors, wherein thevertical connectors are positioned substantially within the firstperimeter and the second perimeter, and wherein the second major planarsurface of the second substrate is substantially available for receivingone or more electronic components. The first semiconductor die can beelectrically coupled to the second major planar surface of the firstsubstrate in a flip chip configuration. In other embodiments, the firstsemiconductor die is electrically coupled to the second major planarsurface of the first substrate with at least one bond wire.

The package can further comprise a second encapsulating resin situatedbetween the second surface of the first substrate and the first surfaceof the second substrate. In some embodiments the first encapsulatingresin and the second encapsulating resin comprise a continuousencapsulating resin. In further embodiments, at least one of the firstplurality of vertical connectors comprises a bond-on-lead (BOL)connection. In additional embodiments, at least one of the firstplurality of vertical connectors comprises a stud bump. In someembodiments, the first encapsulating resin comprises at least one of anepoxy material, a thermosetting material, and a thermoplastic material.

In some embodiments, the second major planar surface of the secondsubstrate is configured to receive an electronic component. The secondmajor planar surface of the second substrate can be further configuredto receive a ball grid array, at least part of the ball grid arrayhaving a ball pitch between about 0.25 mm and about 1.0 mm. In otherembodiments, the second major planar surface of the second substrate canbe configured to receive at least one of the following: a flip chipcomponent, a quad flat package, a quad flat package no leads, a moldedpackage, or a passive component. In other embodiments of thesemiconductor package, the first perimeter comprises a plurality ofperimeter sides, and wherein at least some of the first plurality ofvertical connectors are situated at two, three, four or more of theperimeter sides. In some embodiments, at least some of the firstplurality of vertical connectors are generally diametrically opposedalong at least one of the first and second perimeter.

In additional embodiments, the first substrate has a first substrateedge and the first semiconductor die has a first die edge, and thehorizontal distance between the first die edge and the first substrateedge is between about 0.25 mm and about 1.5 mm. In further embodiments,the distance is between about 0.25 mm and about 1.0 mm. In otherembodiments the horizontal distance is approximately equal to a verticalconnector width. In further embodiments, the vertical distance between asurface of the first semiconductor die facing the first substrate andthe first major planar surface of the second substrate is less thanabout 0.2 mm.

In other embodiments, the semiconductor package further comprises: athird substrate having first and second major planar surfaces defined bya third perimeter; a second semiconductor die electrically coupled tothe second major planar surface of the third substrate; and a secondplurality of vertical connectors, the connectors being configured toelectrically couple the first major planar surface of the firstsubstrate to the second major planar surface of the third substrate.

In an additional embodiment, a method of fabricating a semiconductorpackage comprises: providing a first substrate, a semiconductor die, asecond substrate, and one or more vertical connectors, the first andsecond substrates both having first and second major planar surfaces;electrically coupling the die to the second major planar surface of thesecond substrate through the second major planar surface of the firstsubstrate, the first major planar surface of the second substrate, andat least one of the one or more vertical connectors, whereinelectrically coupling the die comprises coupling at least one or morevertical connectors to the second major planar surface of the firstsubstrate; and providing an encapsulating resin between the die and thefirst substrate, wherein the encapsulating resin is provided after thecoupling of the at least one or more of the vertical connectors to thesecond major planar surface of the first substrate, and wherein thesecond major planar surface of the second substrate is substantiallyavailable for receiving one or more electronic components. The methodcan further comprise providing an encapsulating resin between the firstsubstrate and the second substrate. A portion of the encapsulating resincan be between the die and the first substrate, and a portion can bebetween the first substrate and the second substrate, the portions beingprovided substantially simultaneously. In some embodiments, theencapsulating resin is provided by printing encapsulation, transfermolding, no flow underfill dispensing, or other molding, underfilling,or encapsulation process.

In some embodiments of the method, electrically coupling the die to thesecond major planar surface of the second substrate can comprise:electrically coupling the die to the second major surface of the firstsubstrate; and electrically coupling the second surface of the firstsubstrate with the first surface of the second substrate through the oneor more vertical connectors. Electrically coupling the die to the secondmajor planar surface of the second substrate through the second majorplanar surface of the first substrate can comprise attaching the die tothe second major planar surface of the first substrate with a pluralityof solder balls, and approximately simultaneously reflowing the one ormore vertical connectors and the solder balls.

In further embodiments of the method, the first substrate has a firstedge and the die has a first edge, and wherein the horizontal distancebetween the first edge of the die and the first edge of the firstsubstrate is between about 0.25 mm and about 1.5 mm. In additionalembodiments, the horizontal distance is between about 0.25 mm and about1.0 mm.

In some embodiments of the method, the steps of attaching thesemiconductor die and providing the second substrate are performedsubstantially simultaneously. In other embodiments, the method furthercomprises electrically coupling an additional semiconductor device tothe second major planar surface of the second substrate.

Other embodiments of the disclosed technology include a semiconductorpackage made according to one or more embodiments of the methoddisclosed herein.

In some further embodiments, a semiconductor package comprises a firstsubstrate having first and second major planar surfaces defined by afirst perimeter, the second major planar surface having a semiconductordie coupled thereto, and a second substrate consisting of first andsecond major planar surfaces defined by a second perimeter, the firstmajor planar surface of the second substrate being effectively coupledto the second major planar surface of the first substrate by one or morevertical connectors, wherein the vertical connectors are positionedsubstantially within the first perimeter and the second perimeter,wherein the first substrate has a first substrate edge and the die has afirst substrate edge, and wherein the horizontal distance between thefirst die edge and the first substrate edge is between about 0.25 mm andabout 1.5 mm.

The foregoing and other objects, features, and advantages of thedisclosed technologies will become more apparent from the followingdetailed description, which proceeds with reference to the accompanyingfigures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of one embodiment of a semiconductor package.

FIG. 2 shows a side cross-sectional view of the package of FIG. 1.

FIG. 3 shows a side cross-sectional view of the package of FIG. 1 withan additional semiconductor package.

FIG. 4 is a side cross-sectional view of an alternative embodiment of adisclosed semiconductor package.

FIG. 5 is a close-up, cross-sectional view of one embodiment of avertical connector.

FIG. 6 is a close-up, cross-sectional view of one embodiment of avertical connector.

FIG. 7 is a close-up, cross-sectional view of one embodiment of avertical connector.

FIG. 8 is a flowchart of one embodiment of a method of making asemiconductor package.

FIG. 9 is a flowchart of one embodiment of a method of electricallycoupling a die to a top surface of an interposer substrate.

FIG. 10 is a plan view of one embodiment of a semiconductor package.

FIG. 11 is a side cross-sectional view of an embodiment of asemiconductor package.

FIG. 12 is a side cross-sectional view of an embodiment of asemiconductor package.

DETAILED DESCRIPTION

As used in this application and in the claims, the singular forms “a,”“an,” and “the” include the plural forms unless the context clearlydictates otherwise. Additionally, the term “includes” means “comprises.”Further, the term “coupled” means electrically, electromagnetically ormechanically coupled or linked and does not exclude the presence ofintermediate elements between the coupled items.

Although the operations of example embodiments of the disclosed methodare described in a particular, sequential order for convenientpresentation, it should be understood that disclosed embodiments canencompass an order of operations other than the particular, sequentialorder disclosed. For example, operations described sequentially may insome cases be rearranged or performed concurrently. Moreover, for thesake of simplicity, the attached figures may not show the various ways(readily discernable, based on this disclosure, by one of ordinary skillin the art) in which the disclosed system, method, and apparatus can beused in conjunction with other systems, methods, and apparatuses.Additionally, the description sometimes uses terms like “produce” and“provide” to describe the disclosed method. These terms are high-levelabstractions of the actual operations that can be performed. Forexample, “providing” a component can mean making that componentavailable for use or configuration with additional components. Theactual operations that correspond to these terms can vary depending onthe particular implementation and are, based on this disclosure, readilydiscernible by one of ordinary skill in the art.

The term “horizontal” as used herein is defined as being in the plane ofthe major planar opposed surfaces of the appropriate component,regardless of the component's orientation. The term “vertical” refers toa direction generally perpendicular to the horizontal as just defined.Terms, such as “on,” “above,” “below,” “bottom,” “top,” “side,”“higher,” “lower,” and “under,” are defined with respect to thehorizontal plane.

Exemplary Embodiments of a Semiconductor Package

FIG. 1 is a plan view of one embodiment of a semiconductor package 100.The package 100 can comprise an interposer substrate 110 positionedeffectively with respect to a semiconductor die 120, such as on top ofthe die 120 (indicated by a dotted outline in this view) and a basesubstrate 130. In some embodiments, the substrates 110 and 130 haveapproximately the same horizontal area. In other embodiments they canhave substantially different horizontal areas. The embodiment of FIG. 1shows the substrate 110 as being slightly smaller than the substrate130. The interposer substrate 110 can comprise one or more I/O terminals140 that can be arranged as desired for electrically coupling to the die120 or the base substrate 130.

FIG. 2 shows a side cross-sectional view of the package 100 taken alongthe line 2-2 in FIG. 1. As shown in FIG. 2, the interposer substrate 110comprises two major planar opposed surfaces, namely a top surface 112and a bottom surface 114, defined by a perimeter formed by the edges ofthe substrate 110. The base substrate 130 similarly comprises two majorplanar opposed surfaces, namely a top surface 132 and a bottom surface134, defined by a perimeter formed by the edges of the substrate 130.The base substrate 130 can comprise one or more I/O terminals 142 thatcan be similar to the I/O terminals 140 of the interposer substrate 110.(Some features in the figures, e.g., the terminals 140, 142, aredepicted in simplified versions in order to more clearly illustrateother features of the embodiments.) The terminals 140, 142 can beconfigured to carry electrical signals between one point on a substratesurface to another point on the surface, or between different substratesurfaces.

In the embodiment of FIG. 2, the die 120 is mounted in a flip chipconfiguration, with a plurality of solder balls 122 or similarelectrical connections electrically coupling the die 120 to one or moreof the base substrate terminals 142. The base substrate 130 can beelectrically coupled to the interposer substrate 110 through one or morevertical connectors such as representative vertical connectors 150, 154.In this way, electrical connections from the base substrate 130 can be“wrapped around” the die 120 to the interposer substrate 110. In someembodiments, the vertical connectors 150 do not extend horizontallybeyond the edges of the substrates 110, 130, permitting compactpackages.

As shown in FIG. 1, the package 100 can be configured such that verticalconnectors are positioned near one, two, three, four or more edges ofthe package 100, as exemplified by the vertical connectors 150, 152,154, 156. FIG. 10 shows a plan view of an exemplary embodiment of apackage 1000 configured such that vertical connectors are positionednear five edges of the package 1000 (see, e.g., vertical connectors1010, 1020, 1030, 1040, 1050). Exemplary embodiments of such connectorsare described below. As shown in FIG. 2, the package 100 can furthercomprise a material 160 between the substrates 110, 130, as well asbetween the die 120 and one or both of the substrates 110, 130. In someembodiments, material 160 comprises an encapsulating resin and isapplied through an underfill process (e.g., needle dispensing,no-flow-underfill). As used in this specification and in the claims, an“encapsulating resin” refers to a material in the package that:generally defines a space between two or more components; serves to atleast partially fill a gap between two or more components; and/or issituated at the perimeter of one or more substrates to at leastpartially define a shape of a package and/or seal a region of thepackage. The encapsulating resin can provide, e.g.: a predeterminedthermal conductivity; a predetermined electrical conductivity; and abarrier to environmental contaminants. A number of suitable materialscan be used for the encapsulating resin, for example, an epoxy material,a thermosetting material, or a thermoplastic material. In someembodiments these materials are used with filler particles, and in otherembodiments they are used without filler particles. In otherembodiments, material 160 is applied using an overmolding encapsulationprocess. (To provide a clearer view of the base substrate 130, thematerial 160 is not shown in FIG. 1.) Solder balls 170 or otherelectrical connections can be provided to electrically couple the basesubstrate 130 to other circuit elements or components, such as, forexample, a printed circuit board.

The package 100 can be configured such that the area occupied by thepackage 100 on a mounting surface (e.g., a printed circuit board) isonly slightly larger than the horizontal area of die 120. In someembodiments, a distance d₂ between an edge 124 of the die 120 and anedge 136 of the base substrate 130 (or, similarly, an edge of theinterposer substrate 110) is between about 0.25 mm and about 1 mm. Asimilar distance in some chip-scale package (CSP) designs can be, forexample, about 2 mm to about 3 mm. However, the package 100 can also bedesigned such that its area is much larger than the area of the die 120.In further embodiments, the package 100 can comprise multiplesemiconductor die (not shown) positioned on and electrically coupled tothe base substrate 130.

In other embodiments, the top surface 112 of the substrate 110 isoccupied at least in part by an additional semiconductor die (or otherelectronic component) coupled to the terminals 140, 142. FIG. 11 shows aside cross-sectional view of an exemplary embodiment of a package 1100comprising a portion 1110 similar to the package 100. The package 1100further comprises an additional substrate 1120 (possibly similar to thesubstrates 110, 130) positioned on top of an additional die 1130, withvertical connectors 1140, 1142 (possibly similar to the verticalconnectors 150, 152, 154, 156) electrically coupling the additionalsubstrate 1120 to the terminals 140, 142. Thus, the package 1100 cancomprise multiple die sandwiched among multiple layers of substrates.

One advantage of some configurations of the package 100 is that I/Oterminals can be configured to emerge on both the top and bottomsurfaces of the package. Additionally, most or all of the top surface112 of the interposer substrate 110 can be available for the terminals140. The top surface 112 can present a flat or approximately flatmounting surface, whereas other packages sometimes have a raisedfeature, such as a mold cap for a die that interrupts the mountingsurface. These features of the package 100 can facilitatethree-dimensional integration of multiple semiconductor components.

In a further embodiment, FIG. 3 shows a side cross-sectional view of thepackage 100 with an electronic component 180 mounted on top of thepackage 100. The electronic component 180 can be electrically coupled tothe package 100 through the one or more of the terminals 140 at the topsurface 112 of the interposer substrate 110. In one embodiment, theterminals 140, 142 and the vertical connectors 150, 152, 154, 156 can beconfigured to electrically couple the electronic component 180 and thedie 120. In another embodiment, the terminals 140, 142 and the verticalconnectors 150 can be configured to provide one or more electricalconnections between the electronic component 180 and solder balls 170.In a further embodiment, the terminals 140, 142 and the verticalconnectors 150 can be configured to create electrical connectionsbetween the electronic component 180, the die 120 and the solder balls170.

In some embodiments, the die 120 of the package 100 is a microprocessoror other microchip and the electronic component 180 is a packagecontaining a memory element that can operate in conjunction with the die120. In other embodiments, the electronic component 180 comprises, e.g.,one or more additional processors, one or more discrete components(e.g., passive or active), a flip chip component, a quad flat package(QFP), a quad flat package no leads (QFN), a molded package, orcombinations thereof.

FIG. 3 depicts the electronic component 180 as comprising a ball gridarray (BGA) 182 for connecting to the interposer substrate 110. Somesemiconductor packages provide a mounting surface along the peripheralarea of the package for receiving a BGA, with a raised feature in thecenter of or near the mounting surface (e.g., a mold cap for a die inthe package). When an additional device using a BGA is mounted on such apackage, the ball pitch of the BGA is usually chosen to be large enoughto lift the additional device over the raised feature. In such devices,the ball pitch can be, for example, about 0.65 mm. In some embodimentsof the package 100 in FIG. 3, the generally level top surface 112 of theinterposer substrate 110 does not require the BGA 182 of the electroniccomponent 180 to lift the electronic component 180 over a raised area.Accordingly, the pitch of the BGA 182 can be smaller than in at leastsome prior art designs. This smaller BGA pitch can allow for a smalleroverall package height (e.g., in some embodiments, about 0.28 mm fromthe bottom surface 134 of the substrate 130 to the top surface 112 ofthe substrate 110), as well as for a higher-density BGA 182. Forexample, in some embodiments the ball pitch can be between about 0.25 mmand 0.3 mm, but in other embodiments, the ball pitch can be smaller orlarger. In some further embodiments, the electronic component 180 can beconnected to the substrate 110 using wire bonding or other techniquesknown in the art. In alternative embodiments of the package 100, the topsurface 112 of the interposer substrate 110 can comprise one or moreraised features.

FIG. 4 is a side cross-sectional view of a semiconductor package 400. Inthis embodiment the package 400 is similar to the package 100. But, forthe embodiment of FIG. 4, a die 420 is configured not as a flip chip butas a wire-bonded die with bond wires 444, 446 electrically coupling thedie 420 to a base substrate 430. A semiconductor package 480 (or otherelectronic component) can be mounted on top of the package 400. FIG. 12is a side cross-sectional view of a further exemplary embodiment of asemiconductor package 1200. This embodiment is similar to the package400 in that it comprises a die 1210 coupled to a surface 1220 of asubstrate 1230 in a wire-bond configuration. In the package 1200, thedie 1210 is at least partially separated from the substrate surface 1220by a layer of encapsulating resin 1240.

Several embodiments of the vertical connectors 150 can be used in thepackages 100, 400. FIG. 5 is an enlargement of the region 190 of FIG. 2showing one embodiment of a vertical connector 550 for electricallycoupling an interposer substrate 510 and a base substrate 530. Alsoshown in this enlargement view are an encapsulating resin (e.g., anepoxy material, a thermosetting material, or a thermoplastic material)560 and a die 520, the die 520 being electrically coupled to the basesubstrate 530 by one or more solder balls 522 or similar connectors. Anattachment layer 524, comprising an adhesive, for example, can provide aphysical connection between the substrate 510 and the die 520. In someembodiments of the package shown in FIG. 5 (and in some embodiments ofthe packages shown in FIGS. 6 and 7 below), the space occupied by alayer such as the attachment layer 524 can be filled instead with amolding compound. However, in order to allow the molding compound topenetrate to this region, an adequate clearance for the molding shouldbe provided between the top of the die 520 and the bottom of theinterposer substrate 510. The necessary “mold clearance” is usually atleast about 0.2 mm. Thus, in some embodiments, package height can bereduced by not placing molding compound between the top of the die 520and the bottom of the interposer substrate 510. As is further shown inthe depicted embodiment, the vertical connector 550 comprises aconductive bead 552 electrically coupled to a conductive trace 556 onthe interposer substrate 510. The bead 552 is also electrically coupledto a lead 554 to form a bond-on-lead (BOL) connection. The lead 554 canbe further electrically coupled to a conductive trace 558 on the basesubstrate 530. The bead 552 can comprise one or more conductivematerials, such as gold or solder, and can be applied to the trace 556using solder-on-pad (SOP) technology, or can be otherwise coupled to thetrace 556.

FIG. 6 is an enlargement of the region 190 of FIG. 2 showing a furtherembodiment of a vertical connector 650 for electrically coupling aninterposer substrate 610 and a base substrate 630. Also shown in thisenlargement view are an encapsulating resin (e.g., an epoxy material, athermosetting material, or a thermoplastic material) 660 and a die 620,the die 620 being electrically coupled to the base substrate 630 by oneor more solder balls 622 or similar connectors. An attachment layer 624,comprising an adhesive, for example, can provide a physical connectionbetween the substrate 610 and the die 620. In this embodiment, thevertical connector 650 comprises a conductive bead 652 that iselectrically coupled to a conductive trace 656 on the interposersubstrate 610. The bead 652 can comprise one or more conductivematerials, such as gold or solder, and can be applied to the trace 656using solder-on-pad (SOP) technology, as is well known in the art. Thesolder bead 652 also can be electrically coupled to a stud bump 654,which can comprise a number of different stud bump materials known inthe art. In some embodiments, the stud bump 654 is comprised of gold.The stud bump 654 can be further electrically coupled to a conductivetrace 658 on the base substrate 630.

FIG. 7 is an additional embodiment of the region 190 of FIG. 2. Thisembodiment shows a solder ball 750 acting as a vertical connectorbetween a base substrate 730 and an interposer substrate 710. The solderball 750 is electrically coupled to a conductive trace 756 on theinterposer substrate 710 and to a conductive trace 758 on the basesubstrate 730. Also shown in this enlargement are a die 720 electricallycoupled to the base substrate 730 with one or more solder balls 722 orsimilar connectors, as well as an encapsulating resin (e.g., an epoxymaterial, a thermosetting material, or a thermoplastic material) 760. Anattachment layer 724, comprising an adhesive, for example, can provide aphysical connection between the substrate 710 and the die 720.

A given package configuration can be configured to use one or more ofthe vertical connector embodiments described above, as well as othertypes of vertical connectors.

Packages using the vertical connectors depicted in FIGS. 5 and 6 can beconfigured to be more compact than packages using the vertical connectordepicted in FIG. 7. The vertical connector embodiments of FIGS. 5 and 6can be configured to use traces (e.g., traces 556, 558 of FIG. 5 andtraces 656, 658 of FIG. 6) that are smaller than the correspondingtraces used by the vertical connector embodiment of FIG. 7 (e.g., traces756, 758). Accordingly, the vertical connectors of FIGS. 5 and 6 canallow for improved routing efficiency in a given substrate space, aswell as a shorter distance d between the edge of the die and the edge ofthe largest substrate (which, in the embodiments of FIGS. 5-7, are thebase substrates 530, 630, 730, respectively). The distance d isindicated in FIGS. 5, 6 and 7 by d₅, d₆ and d₇, respectively. In thedepicted embodiments, d₇>d₅ and d₇>d₆. The distance d can beapproximately the same as the width of a vertical connector. This can,in turn, allow for a package with a horizontal size that is close tothat of the packaged die.

Exemplary Embodiments of the Disclosed Method

FIG. 8 is a flowchart of an exemplary embodiment of a method 800 ofmaking a semiconductor package. Package components are provided in astep 810. These components can include a base substrate, an interposersubstrate, a semiconductor die, and one or more vertical connectors. Thebase and interposer substrates both have a top surface and a bottomsurface. In some embodiments, one or more components can be providedsimultaneously or approximately simultaneously. For example, thevertical connectors and the interposer substrate can be providedsimultaneously. The die is electrically coupled to the top surface ofthe interposer substrate in a step 820.

FIG. 9 is a flowchart of one embodiment of a method for carrying outstep 820 of FIG. 8. The method can comprise electrically coupling thedie to the top surface of the base substrate (step 910). As describedabove, the die and the base substrate can be electrically coupled usinga number of configurations known in the art, such as a wire bondconfiguration or a flip chip configuration. One or more verticalconnectors can be formed (e.g., on the top surface of the basesubstrate, on the bottom surface of the interposer substrate, or both)(step 920). The base and interposer substrates can be electricallycoupled through the vertical connectors (step 930). In furtherembodiments, the interposer substrate can be provided by apick-and-place process, possibly simultaneously, or approximatelysimultaneously, with the die being coupled to the base substrate.

Returning to FIG. 8, in additional embodiments, the method 800optionally can further comprise one or more reflow steps 830. A refillstep can be used for packages with die employing a flip chipconfiguration, as well as for packages employing the vertical connectorconfigurations described in FIGS. 5-7. In some embodiments, a firstreflow step can occur after the die is placed and a second reflow stepcan occur after the interposer substrate is placed. In otherembodiments, a single reflow step can be used for both the die and thevertical connectors between the base and interposer substrates.

In other embodiments, the method 800 optionally can further comprise oneor more underfill steps 840. In some embodiments, if the die iselectrically coupled to the base substrate in a flip chip configuration,the die can be underfilled using an encapsulating resin (e.g., an epoxymaterial, a thermosetting material, or a thermoplastic material), as iswell known in the art. The space between the interposer substrate andthe base substrate can also be underfilled, possibly in a later,additional step. When a flip chip die is underfilled, the encapsulatingresin can create a fillet around the edge of the chip that extends outalong the top surface of the base substrate. If the vertical connectorsare added after this fillet forms, they can be placed outside the filletperimeter. However, this increases the amount of space used on the topsurface of the base substrate, and the surface beneath the fillet(sometimes referred to as a “keep-out region”) is unavailable. Thisconfiguration can require a larger substrate and thus increase the sizeof the package. Multiple underfill steps can result in one or moreinterfaces between materials of the different underfill steps. In someembodiments, the flip chip and the interposer substrate aresimultaneously underfilled after the vertical connectors are in place(in some embodiments, such that the encapsulating resin encompasses atleast a portion of some of the vertical connectors). This can reduce thenumber of underfill steps 840, as well as allow for closer placement ofthe vertical connectors to the die (potentially allowing for a smallerpackage size).

For embodiments where the die is coupled to the base substrate in a wirebond configuration, the underfill step 840 can comprise underfilling aspace between the face of the die and the interposer substrate, as wellas a space between the interposer substrate and the base substrate. Inother embodiments, the underfill step 840 can comprise covering the die(before placement of the interposer substrate) with an encapsulatingresin through printing encapsulation (e.g., by printing a layer ofmaterial on top of the die). In such embodiments, at least part of thevertical connectors can be formed on the interposer substrate, and theinterposer substrate can be placed (step 830) such that the verticalconnectors are pushed through the printed encapsulating resin, theinterposer substrate thereby becoming electrically coupled to the basesubstrate. A reflow step 830 can then be provided.

In further embodiments, an additional semiconductor component can beelectrically coupled with the top surface of the interposer substrate(step 850). This can be done independently of any underfill or reflowsteps.

The disclosed materials and structures, and embodiments of the methodfor making and using such materials and structures, should not beconstrued as limiting in any way. Instead, the present disclosure isdirected toward all novel and nonobvious features, aspects, andequivalents of the various disclosed embodiments, alone and in variouscombinations and sub-combinations with one another. The disclosedtechnology is not limited to any specific aspect, feature, orcombination thereof, nor do the disclosed materials, structures, andmethod require that any one or more specific advantages be present orproblems be solved. We claim all that is encompassed by the followingclaims.

1. A semiconductor package comprising: a first substrate having firstand second major planar surfaces defined by a first perimeter; a firstsemiconductor die electrically coupled to the second major planarsurface of the first substrate; a second substrate having first andsecond major planar surfaces defined by a second perimeter; a firstplurality of vertical connectors, the connectors having at least apartial internal core and being configured to electrically couple thefirst major planar surface of the second substrate to the second majorplanar surface of the first substrate; and a first encapsulating resinsituated between the semiconductor die and the second major planarsurface of the first substrate, the first encapsulating resin alsoencompassing at least a portion of at least some of the verticalconnectors, wherein the vertical connectors are positioned substantiallywithin the first perimeter and the second perimeter, and wherein thesecond major planar surface of the second substrate is substantiallyavailable for receiving one or more electronic components.
 2. Thesemiconductor package of claim 1, wherein the first semiconductor die iselectrically coupled to the second major planar surface of the firstsubstrate in a flip chip configuration.
 3. The semiconductor package ofclaim 1, wherein the first semiconductor die is electrically coupled tothe second major planar surface of the first substrate with at least onebond wire.
 4. The semiconductor package of claim 1, further comprising asecond encapsulating resin situated between the second major planarsurface of the first substrate and the first surface of the secondsubstrate.
 5. The semiconductor package of claim 4, wherein the firstencapsulating resin and the second encapsulating resin comprise acontinuous resin material.
 6. The semiconductor package of claim 1,wherein at least one of the first plurality of vertical connectorsincludes the at least a partial internal core being a lead.
 7. Thesemiconductor package of claim 1, wherein at least one of the firstplurality of vertical connectors includes the at least a partialinternal core being a stud bump.
 8. The semiconductor package of claim1, wherein the second major planar surface of the second substrate isconfigured to receive an electronic component.
 9. The semiconductorpackage of claim 8, wherein the second major planar surface of thesecond substrate is further configured to receive a ball grid array,wherein at least a portion of the ball grid array has a ball pitchbetween about 0.25 mm and about 1.0 mm.
 10. The semiconductor package ofclaim 8, wherein the second major planar surface of the second substrateis configured to receive at least one of the following: a flip chipcomponent, a quad flat package, a quad flat package no leads, a moldedpackage, or a passive component.
 11. The semiconductor package of claim1, wherein the first perimeter comprises a plurality of perimeter sides,and wherein at least some of the first plurality of vertical connectorsare situated at two or more of the perimeter sides.
 12. Thesemiconductor package of claim 11, wherein at least some of the firstplurality of vertical connectors are situated at three or more perimetersides.
 13. The semiconductor package of claim 12, wherein at least someof the first plurality of vertical connectors are situated at four ormore perimeter sides.
 14. The semiconductor package of claim 1, whereinat least some of the first plurality of vertical connectors aregenerally diametrically opposed along at least one of the first andsecond perimeter.
 15. The semiconductor package of claim 1, wherein thefirst substrate has a substrate edge and the first semiconductor die hasa die edge, and wherein the horizontal distance between the die edge andthe substrate edge is between about 0.25 mm and about 1.5 mm.
 16. Thesemiconductor package of claim 15, wherein the horizontal distancebetween the die edge and the substrate edge is between about 0.25 mm andabout 1.0 mm.
 17. The semiconductor package of claim 1, wherein thefirst substrate has a substrate edge and the first semiconductor die hasa die edge, and wherein the horizontal distance between the die edge andthe substrate edge is approximately equal to a vertical connector width.18. The semiconductor package of claim 1, wherein the vertical distancebetween a surface of the first semiconductor die facing the firstsubstrate and the first major planar surface of the second substrate isless than about 0.2 mm.
 19. The semiconductor package of claim 1,wherein the first encapsulating resin comprises at least one of an epoxymaterial, a thermosetting material, and a thermoplastic material. 20.The semiconductor package of claim 1, further comprising: a thirdsubstrate having first and second major planar surfaces defined by athird perimeter; a second semiconductor die electrically coupled to thesecond major planar surface of the third substrate; and a secondplurality of vertical connectors, the connectors being configured toelectrically couple the first major planar surface of the firstsubstrate to the second major planar surface of the third substrate. 21.A method of fabricating a semiconductor package, the method comprising:providing a first substrate, a semiconductor die, a second substrate,and one or more vertical connectors, the first and second substratesboth having first and second major planar surfaces; electricallycoupling the die to the second major planar surface of the secondsubstrate through the second major planar surface of the firstsubstrate, the first major planar surface of the second substrate, andat least one of the one or more vertical connectors, whereinelectrically coupling the die comprises coupling at least one or morevertical connectors to the second major planar surface of the firstsubstrate; and providing an encapsulating resin between the die and thefirst substrate, wherein the encapsulating resin is provided after thecoupling of the at least one or more of the vertical connectors to thesecond major planar surface of the first substrate, and wherein thesecond major planar surface of the second substrate is substantiallyavailable for receiving one or more electronic components.
 22. Themethod of claim 21, further comprising providing an encapsulating resinbetween the first substrate and the second substrate.
 23. The method ofclaim 22, wherein at least some of the encapsulating resin is providedby printing encapsulation.
 24. The method of claim 22, wherein at leastsome of the encapsulating resin is provided by transfer molding.
 25. Themethod of claim 22, wherein at least some of the encapsulating resin isprovided by no flow underfill dispensing.
 26. The method of claim 22,wherein at least some of the encapsulating resin is provided byunderfilling.
 27. The method of claim 22, wherein a portion of theencapsulating resin between the die and the first substrate and aportion of the encapsulating resin between the first substrate and thesecond substrate are provided substantially simultaneously.
 28. Themethod of claim 22, wherein a portion of the encapsulating resin betweenthe die and the first substrate and a portion of the encapsulating resinbetween the first substrate and the second substrate are provided in onestep.
 29. The method of claim 21, wherein electrically coupling the dieto the second major planar surface of the second substrate comprises:electrically coupling the die to the second major surface of the firstsubstrate; and electrically coupling the second surface of the firstsubstrate with the first surface of the second substrate through the oneor more vertical connectors.
 30. The method of claim 21, whereinelectrically coupling the die to the second major planar surface of thesecond substrate through the second major planar surface of the firstsubstrate comprises: attaching the die to the second major planarsurface of the first substrate with a plurality of solder balls; andapproximately simultaneously reflowing the one or more verticalconnectors and the solder balls.
 31. The method of claim 21, wherein thefirst substrate has a first edge and the die has a first edge, andwherein the horizontal distance between the first edge of the die andthe first edge of the first substrate is between about 0.25 mm and about1.5 mm.
 32. The method of claim 31, wherein the horizontal distancebetween the first edge of the die and the first edge of the firstsubstrate is between about 0.25 mm and about 1.0 mm.
 33. The method ofclaim 21, wherein the steps of attaching the semiconductor die andproviding the second substrate are performed substantiallysimultaneously.
 34. The method of claim 21, further comprisingelectrically coupling an additional semiconductor device to the secondmajor planar surface of the second substrate.